STMicroelectronics has released the ACEPACK DMT-32 family of silicon carbide (SiC) power modules in a 32-pin, dual-inline, moulded, through-hole package for automotive applications. Targeted at ...
The FOD2741 optically isolated error amplifier combines an optocoupler, a precision reference, and an error amplifier in an eight-pin, dual-inline package. The ...
Mitsubishi Electric Corporation announced it will launch a transfer-mold-type, super-mini dual inline package intelligent power module (DIPIPM) primarily used for inverter drive systems of ...
New Optocoupler Packages are Half the Size of Standard Dual-Inline Packages, and Meet Stringent Safety Regulations. Avago's ACPL-W302 and ACPL-W314 gate drive optocouplers are an ideal solution for ...
Mitsubishi Electric has launched a 1200V large-type Transfer-molded Dual Inline Package Intelligent Power Module (DIPIPM) Version 4 (PS22A79) with a current rating of 50A. The new power module is ...
DIP through-hole chips are an old package with instantly recognizable dual in-line pin rows. Beginners love these chips because they’re large and look easy to solder; we abhor them because we hate ...
Chip die sizes continue to grow, as does the number of connections. The switch to high-speed serial interfaces reduced the required pin count, but that simply slowed the pin count down. Dual inline ...
DUAL Portimão realizou Cerimónia de Entrega de Diplomas 2025 A DUAL Portimão promoveu, no Portimão Arena, a sua habitual cerimónia de entrega de diplomas, distinguindo formandos que concluíram a sua formação em 2025 – qualificação inicial e contínua e formandos certificados em língua inglesa através da TELC. Ler mais
Dia Aberto DUAL 2026 -Durante os meses de março e abril, a DUAL abriu portas nos seus três centros, Lisboa, Portimão e Porto, para três dias dedicados à partilha, descoberta e contacto direto com a formação profissional, com um objetivo claro: dar a conhecer a DUAL a futuros formandos.